Global Wafer-Level Chip Scale Packaging Technology Market Insights, Forecast to 2028

Wafer level chip scale packaging (WLCSP) is a wafer level chip packaging method, which is different from the traditional chip packaging method (cutting first and then sealing and testing, and at least 20% of the volume of the original chip is increased after packaging) , this latest technology is to package and test the whole wafer before cutting it into IC particles. Therefore, the volume after packaging is equal to the original size of IC bare crystal.
Market Analysis and Insights: Global Wafer-Level Chip Scale Packaging Technology Market
Due to the COVID-19 pandemic, the global Wafer-Level Chip Scale Packaging Technology market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, FOC WLCSP accounting for % of the Wafer-Level Chip Scale Packaging Technology global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Consumer Electronics segment is altered to an % CAGR throughout this forecast period.
China Wafer-Level Chip Scale Packaging Technology market size is valued at US$ million in 2021, while the US and Europe Wafer-Level Chip Scale Packaging Technology are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Wafer-Level Chip Scale Packaging Technology landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of Wafer-Level Chip Scale Packaging Technology include TSMC, China Wafer Level CSP, Texas Instruments, Amkor, Toshiba, Advanced Semiconductor Engineering, JCET Group, Huatian Technology and TongFu Microelectronics, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Wafer-Level Chip Scale Packaging Technology capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Wafer-Level Chip Scale Packaging Technology by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Wafer-Level Chip Scale Packaging Technology Scope and Segment
Wafer-Level Chip Scale Packaging Technology market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Wafer-Level Chip Scale Packaging Technology market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
FOC WLCSP
RPV WLCSP
RDL WLCSP
Segment by Application
Consumer Electronics
Automobile
Medical
Communication
Security Monitoring
Identification
Others
By Company
TSMC
China Wafer Level CSP
Texas Instruments
Amkor
Toshiba
Advanced Semiconductor Engineering
JCET Group
Huatian Technology
TongFu Microelectronics
CASMELT (NCAP China)
Keyang Semiconductor Technology
China Resources Microelectronics Holdings
JS nepes
Aptos
PEP Innovation
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE