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Global Wafer Bonder Market Insights and Forecast to 2027
SKU ID : QYR-18113781 | Publishing Date : 27-Apr-2021 | No. of pages : 112
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Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.
The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world's leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany's SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.
Market Analysis and Insights: Global Wafer Bonder Market
The global Wafer Bonder market is valued at US$ 116.5 million in 2019. The market size will reach US$ 199.7 million by the end of 2026, growing at a CAGR of 7.7% during 2021-2026.
Global Wafer Bonder Scope and Segment
Wafer Bonder market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.
Segment by Type
Semi-Automated Wafer Bonder
Automated Wafer Bonder
Semi-automated wafer bonder is the major type, accounted for 76.27% market share in 2019.
Segment by Application
MEMS
Advanced Packaging
CMOS
Others
In the downstream market, wafer bonding can be widely used in MEMS, advanced packaging, CMOS and other industries.Among them, MEMS market is the largest market, accounting for 35.49% of the market.Advanced packaging is the second largest market with 30.97%, while CMOS and other applications occupy a smaller market.
By Company
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world's leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany's SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.
Market Analysis and Insights: Global Wafer Bonder Market
The global Wafer Bonder market is valued at US$ 116.5 million in 2019. The market size will reach US$ 199.7 million by the end of 2026, growing at a CAGR of 7.7% during 2021-2026.
Global Wafer Bonder Scope and Segment
Wafer Bonder market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027.
Segment by Type
Semi-Automated Wafer Bonder
Automated Wafer Bonder
Semi-automated wafer bonder is the major type, accounted for 76.27% market share in 2019.
Segment by Application
MEMS
Advanced Packaging
CMOS
Others
In the downstream market, wafer bonding can be widely used in MEMS, advanced packaging, CMOS and other industries.Among them, MEMS market is the largest market, accounting for 35.49% of the market.Advanced packaging is the second largest market with 30.97%, while CMOS and other applications occupy a smaller market.
By Company
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Frequently Asked Questions
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