Global Through-Silicon Vias (TSVs) Market Size, Status and Forecast 2021-2027

Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 24% of the global market in 2019.
Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. In 2019, These major enterprises account for more than 80% of the total share.

Market Analysis and Insights: Global Through-Silicon Vias (TSVs) Market
The global Through-Silicon Vias (TSVs) market size is projected to reach US$ 6159.2 million by 2027, from US$ 1460.5 million in 2020, at a CAGR of 22.8% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Through-Silicon Vias (TSVs) market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Through-Silicon Vias (TSVs) market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Through-Silicon Vias (TSVs) market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Through-Silicon Vias (TSVs) market.

Global Through-Silicon Vias (TSVs) Scope and Market Size
Through-Silicon Vias (TSVs) market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Through-Silicon Vias (TSVs) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
2.5D Through-Silicon Vias
3D Through-Silicon Vias

Segment by Application
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology