Global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

SKU ID : GIR-13869930 | Publishing Date : 19-Feb-2019 | No. of pages : 139

Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

Scope of the Report:
Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.
Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality.
Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.
The worldwide market for Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) is expected to grow at a CAGR of roughly 1.9% over the next five years, will reach 25700 million US$ in 2024, from 23000 million US$ in 2019, according to a new study.
This report focuses on the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington
Kinwong
Founder Tech
Dynamic
Aoshikang
Wuzhou
CCTC
SZ Fast Print
Guangdong Xinda
Shenzhen Suntak
Redboard

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Layer 4-6
Layer 8-10
Layer 10+

Market Segment by Applications, can be divided into
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Other

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board), with price, sales, revenue and global market share of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) in 2017 and 2018.
Chapter 3, the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) sales channel, distributors, customers, research findings and conclusion, appendix and data source.

Frequently Asked Questions

This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
  • By product type
  • By End User/Applications
  • By Technology
  • By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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