Global IC Advanced Packaging Equipment Market Report, History and Forecast 2016-2027, Breakdown Data by Manufacturers, Key Regions, Types and Application

The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.

Market Analysis and Insights: Global IC Advanced Packaging Equipment Market
In 2020, the global IC Advanced Packaging Equipment market size was US$ 6106.6 million and it is expected to reach US$ 11160 million by the end of 2027, with a CAGR of 9.0% between 2021 and 2027
Global IC Advanced Packaging Equipment Scope and Market Size
The global IC Advanced Packaging Equipment market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global IC Advanced Packaging Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type, and by Application for the period 2016-2027.

Segment by Type
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other

Segment by Application
Automotive Electronics
Consumer Electronics
Other

By Company
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Colombia
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE