Global ESD Foam Packaging Market Insights and Forecast to 2027

Higher dimensional stability of ESD foam compared to other packaging materials for electronic equipment could be a key marker for the rising demand in the global ESD foam packaging market. Furthermore, the ability of ESD foam to be cut into any shape to seamlessly sync with that of electronic equipment is foreseen to be another factor driving the growth of the market.

Market Analysis and Insights: Global ESD Foam Packaging Market
The global ESD Foam Packaging market is valued at US$ 156.8 million in 2019. The market size will reach US$ 201 million by the end of 2026, growing at a CAGR of 3.6% during 2021-2026.

Global ESD Foam Packaging Scope and Market Size
ESD Foam Packaging market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global ESD Foam Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by Type and by Application for the period 2016-2027.

Segment by Type
Conductive and Dissipative Polymer
Metal
Additive

Segment by Application
Electrical and Electronics
Automobile
Defense and Military
Manufacturing
Aerospace
Others

By Company
Nefab
Tekins
Elcom
GWP Group
Botron
Conductive Containers
Helios
Electrotek
Statclean

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia