Global Die Bonder Equipment Sales Market Report 2021

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass
Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.

Market Analysis and Insights: Global Die Bonder Equipment Market
The global Die Bonder Equipment market was valued at US$ 790.9 in 2020 and will reach US$ 815 million by the end of 2027, growing at a CAGR of 0.5% during 2022-2027.

Global Die Bonder Equipment Scope and Market Size
The global Die Bonder Equipment market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Die Bonder Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Fully Automatic Die Bonder
Semi-Automatic Die Bonder
Manual Die Bonder

Segment by Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

The Die Bonder Equipment market is analysed and market size information is provided by regions (countries). Segment by Application, the Die Bonder Equipment market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Besi
ASM Pacific Technology (ASMPT)
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond