Global Ceramic Packaging Market Size, Status and Forecast 2020-2026

Packaging can be divided into metal packaging, ceramic packaging (C), plastic packaging (P).
In the original microelectronics packaging, MetalCan was used as a case to protect vulnerable electronic components in a completely isolated, airtight way.
Using the first two encapsulated semiconductor products are mainly used in aerospace, aviation and military fields, and the plastic package of semiconductor products has been widely used in civilian areas, (epoxy) laminate and has low cost, small size, quality, and can be mass production, now more than 95% of the integrated circuit are using plastic package, in the plastic package, more than 97% are using epoxy encapsulation materials (EMC).
Compared with traditional plastics and epoxy resins, ceramic materials have higher resistivity, thermal conductivity and thermal stability, and are widely used in circuit environments with strict requirements on thermal performance, air tightness and stability.
In terms of materials, packaging substrates can also be classified into organic substrates, ceramic substrates, metal substrates, and silicon/glass substrates for 3D integration.
Among them, organic substrate is the mainstream product of packaging substrate due to its advantages of low joint maturity, low quality density, simple processing technology, high production efficiency and low cost.
From the perspective of product type, the output value of alumina ceramics accounted for 87.67% of the global total in 2019, far higher than that of aluminum nitrite ceramics, which accounted for 8.70%.
From the perspective of application, communication devices are the most widely used field of ceramic packaging, which consumed 26.87% of the global total in 2019, followed by automotive electronics, accounting for 21.62%.
The main manufacturers of ceramic packaging include Kyocera, NGK/NTK, CCTC, etc. Together, the Top 3 players accounted for about 49.56% of the global market in 2019.

Market Analysis and Insights: Global Ceramic Packaging Market
The global Ceramic Packaging market size is projected to reach US$ 3694.4 million by 2026, from US$ 2699.2 million in 2020, at a CAGR of 5.4% during 2021-2026.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Ceramic Packaging market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Ceramic Packaging market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Ceramic Packaging market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Ceramic Packaging market.

Global Ceramic Packaging Scope and Market Size
Ceramic Packaging market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Ceramic Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2015-2026.

Market segment by Type, the product can be split into

Alumina Ceramics
Aluminum Nitride Ceramics
Others

Market segment by Application, split into

Automotive Electronics
Communication Devices
Aeronautics and Astronautics
High Power LED
Consumer Electronics
Others

Based on regional and country-level analysis, the Ceramic Packaging market has been segmented as follows:
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Latin America
Mexico
Brazil
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of Middle East & Africa

In the competitive analysis section of the report, leading as well as prominent players of the global Ceramic Packaging market are broadly studied on the basis of key factors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on price and revenue (global level) by player for the period 2015-2020.

The key players covered in this study

KYOCERA Corporation
NGK/NTK
ChaoZhou Three-circle (Group)
SCHOTT
MARUWA
AMETEK
Hebei Sinopack Electronic Tecnology Co.Ltd
NCI
Yixing Electronic