Global and China Wafer Bonder Market Insights, Forecast to 2027

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.
The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world's leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany's SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.

Market Analysis and Insights: Global and China Wafer Bonder Market
This report focuses on global and China Wafer Bonder market.
In 2020, the global Wafer Bonder market size was US$ 127.8 million and it is expected to reach US$ 215.1 million by the end of 2027, with a CAGR of 7.7% during 2021-2027. In China the Wafer Bonder market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Wafer Bonder Scope and Market Size
Wafer Bonder market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For China market, this report focuses on the Wafer Bonder market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in China.

Segment by Type
Semi-Automated Wafer Bonder
Automated Wafer Bonder

Segment by Application
MEMS
Advanced Packaging
CMOS
Others

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

By Company
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE