Global 3D ICs Market Insights, Forecast to 2025

SKU ID : QYR-14199213

Publishing Date : 14-May-2019

No. of pages : 112

PRICE
4900
9800


  • 3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
    3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
    The 3D ICs market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D ICs.

    This report presents the worldwide 3D ICs market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
    This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

    The following manufacturers are covered in this report:
    Xilinx
    Advanced Semiconductor Engineering (ASE)
    Samsung
    STMicroelectronics
    Taiwan Semiconductors Manufacturing (TSMC)
    Toshiba
    EV Group
    Tessera

    3D ICs Breakdown Data by Type
    3D SiCs
    Monolithic 3D ICs
    3D ICs Breakdown Data by Application
    Automotive
    Smart Technologies
    Robotics
    Electronics
    Medical
    Industrial

    3D ICs Production by Region
    United States
    Europe
    China
    Japan
    South Korea
    Other Regions

    3D ICs Consumption by Region
    North America
    United States
    Canada
    Mexico
    Asia-Pacific
    China
    India
    Japan
    South Korea
    Australia
    Indonesia
    Malaysia
    Philippines
    Thailand
    Vietnam
    Europe
    Germany
    France
    UK
    Italy
    Russia
    Rest of Europe
    Central & South America
    Brazil
    Rest of South America
    Middle East & Africa
    GCC Countries
    Turkey
    Egypt
    South Africa
    Rest of Middle East & Africa

    The study objectives are:
    To analyze and research the global 3D ICs status and future forecast,involving, production, revenue, consumption, historical and forecast.
    To present the key 3D ICs manufacturers, production, revenue, market share, and recent development.
    To split the breakdown data by regions, type, manufacturers and applications.
    To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
    To identify significant trends, drivers, influence factors in global and regions.
    To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

    In this study, the years considered to estimate the market size of 3D ICs :
    History Year: 2014 - 2018
    Base Year: 2018
    Estimated Year: 2019
    Forecast Year: 2019 - 2025

    This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 3D ICs market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

    For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.