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COVID-19 Outbreak-Global Quad-Flat-No-Lead Packaging(QFN) Industry Market Report-Development Trends, Threats, Opportunities and Competitive Landscape in 2020
SKU ID : Maia-15679404 | Publishing Date : 19-May-2020 | No. of pages : 124
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Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
The Quad-Flat-No-Lead Packaging(QFN) market revenue was xx.xx Million USD in 2019, and will reach xx.xx Million USD in 2025, with a CAGR of x.x% during 2020-2025.
Under COVID-19 outbreak globally, this report provides 360 degrees of analysis from supply chain, import and export control to regional government policy and future influence on the industry. Detailed analysis about market status (2015-2020), enterprise competition pattern, advantages and disadvantages of enterprise products, industry development trends (2020-2025), regional industrial layout characteristics and macroeconomic policies, industrial policy has also been included. From raw materials to end users of this industry are analyzed scientifically, the trends of product circulation and sales channel will be presented as well. Considering COVID-19, this report provides comprehensive and in-depth analysis on how the epidemic push this industry transformation and reform.
In COVID-19 outbreak, Chapter 2.2 of this report provides an analysis of the impact of COVID-19 on the global economy and the Quad-Flat-No-Lead Packaging(QFN) industry.
Chapter 3.7 covers the analysis of the impact of COVID-19 from the perspective of the industry chain.
In addition, chapters 7-11 consider the impact of COVID-19 on the regional economy.
The Quad-Flat-No-Lead Packaging(QFN) market can be split based on product types, major applications, and important countries as follows:
Key players in the global Quad-Flat-No-Lead Packaging(QFN) market covered in Chapter 12:
Microchip Technology Inc
UTAC Group
NXP Semiconductor
Texas Instruments
STATS ChipPAC Pte. Ltd
ASE Industrial Holding, Co., Ltd.
Fujitsu Ltd
Linear Technology Corporation
Amkor Technology
In Chapter 4 and 14.1, on the basis of types, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 is primarily split into:
Air-Cavity QFNs
Plastic Molded QFNs
In Chapter 5 and 14.2, on the basis of applications, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 covers:
Portable Devices
Radio Frequency (RF)
Wearable Devices
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2015-2025) of the following regions are covered in Chapter 6, 7, 8, 9, 10, 11, 14:
North America (Covered in Chapter 7 and 14)
United States
Canada
Mexico
Europe (Covered in Chapter 8 and 14)
Germany
UK
France
Italy
Spain
Russia
Others
Asia-Pacific (Covered in Chapter 9 and 14)
China
Japan
South Korea
Australia
India
Southeast Asia
Others
Middle East and Africa (Covered in Chapter 10 and 14)
Saudi Arabia
UAE
Egypt
Nigeria
South Africa
Others
South America (Covered in Chapter 11 and 14)
Brazil
Argentina
Columbia
Chile
Others
2019
The Quad-Flat-No-Lead Packaging(QFN) market revenue was xx.xx Million USD in 2019, and will reach xx.xx Million USD in 2025, with a CAGR of x.x% during 2020-2025.
Under COVID-19 outbreak globally, this report provides 360 degrees of analysis from supply chain, import and export control to regional government policy and future influence on the industry. Detailed analysis about market status (2015-2020), enterprise competition pattern, advantages and disadvantages of enterprise products, industry development trends (2020-2025), regional industrial layout characteristics and macroeconomic policies, industrial policy has also been included. From raw materials to end users of this industry are analyzed scientifically, the trends of product circulation and sales channel will be presented as well. Considering COVID-19, this report provides comprehensive and in-depth analysis on how the epidemic push this industry transformation and reform.
In COVID-19 outbreak, Chapter 2.2 of this report provides an analysis of the impact of COVID-19 on the global economy and the Quad-Flat-No-Lead Packaging(QFN) industry.
Chapter 3.7 covers the analysis of the impact of COVID-19 from the perspective of the industry chain.
In addition, chapters 7-11 consider the impact of COVID-19 on the regional economy.
The Quad-Flat-No-Lead Packaging(QFN) market can be split based on product types, major applications, and important countries as follows:
Key players in the global Quad-Flat-No-Lead Packaging(QFN) market covered in Chapter 12:
Microchip Technology Inc
UTAC Group
NXP Semiconductor
Texas Instruments
STATS ChipPAC Pte. Ltd
ASE Industrial Holding, Co., Ltd.
Fujitsu Ltd
Linear Technology Corporation
Amkor Technology
In Chapter 4 and 14.1, on the basis of types, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 is primarily split into:
Air-Cavity QFNs
Plastic Molded QFNs
In Chapter 5 and 14.2, on the basis of applications, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 covers:
Portable Devices
Radio Frequency (RF)
Wearable Devices
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2015-2025) of the following regions are covered in Chapter 6, 7, 8, 9, 10, 11, 14:
North America (Covered in Chapter 7 and 14)
United States
Canada
Mexico
Europe (Covered in Chapter 8 and 14)
Germany
UK
France
Italy
Spain
Russia
Others
Asia-Pacific (Covered in Chapter 9 and 14)
China
Japan
South Korea
Australia
India
Southeast Asia
Others
Middle East and Africa (Covered in Chapter 10 and 14)
Saudi Arabia
UAE
Egypt
Nigeria
South Africa
Others
South America (Covered in Chapter 11 and 14)
Brazil
Argentina
Columbia
Chile
Others
Years considered for this report:
Historical Years:
2015-2019Base Year:
2019Estimated Year:
2020Forecast Period:
2020-2025Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
