This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn’t change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.

Market Analysis and Insights: Global Underfill Market
The global Underfill market size is projected to reach US$ 509.8 million by 2026, from US$ 422 million in 2020, at a CAGR of 3.2% during 2021-2026.

Global Underfill Scope and Market Size
The global Underfill market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Underfill market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2015-2026.

Segment by Type, the Underfill market is segmented into
Semiconductor Underfills
Board Level Underfills

Segment by Application, the Underfill market is segmented into
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others

The Underfill market is analysed and market size information is provided by regions (countries). Segment by Application, the Underfill market is segmented into United States, Europe, China, Japan, Southeast Asia, India and Rest of World.
The report includes region-wise market size for the period 2015-2026. It also includes market size and forecast by players, by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.

Competitive Landscape

and Underfill Market Share Analysis
Underfill market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Underfill business, the date to enter into the Underfill market, Underfill product introduction, recent developments, etc.

The major vendors covered:
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond