Soldering-type conductive paste, also known as power compound grease, is a new type of electrical material, which can be used for the contact surface of power connectors, and has significant effects of reducing resistance, anti-corrosion and power saving. Our country has been developing and producing since the 1980s. There are dozens of varieties and models, and their basic performance is the same. Mineral oil, synthetic lipid oil, and silicone oil are used as base oils, and special additives such as electrical conductivity, anti-oxidation, anti-corrosion, and arc suppression are added. Soft paste made by grinding, dispersing, modifying and refining. Conductive adhesives are typically heat-cured epoxy or UV-cured acrylate adhesives, with the addition of metallic fillers, such as silver, to achieve conductivity. Adhesive conductive adhesives are often used as a more effective alternative to traditional bonding. Since adhesive conductive adhesives cure at significantly lower temperatures than solder, this adhesive is ideal for making conductive connections in heat-sensitive materials. In addition, such glues are more flexible than solder and therefore better resistant to vibration. Compared with solder, the advantage of adhesive conductive adhesive is that it is lead-free and solvent-free.
Market Analysis and Insights: Global Soldering-type Conductive Paste Market
Due to the COVID-19 pandemic, the global Soldering-type Conductive Paste market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Silver Conductive Paste accounting for % of the Soldering-type Conductive Paste global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Electronic Component segment is altered to an % CAGR throughout this forecast period.
North America Soldering-type Conductive Paste market is estimated at US$ million in 2021, while Europe is forecast to reach US$ million by 2028. The proportion of the North America is % in 2021, while Europe percentage is %, and it is predicted that Europe share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.
The global major manufacturers of Soldering-type Conductive Paste include NAMICS Corporation, Dycotec Materials Ltd., MITSUBOSHI, Henkel, CollTech, Yi Kun Glue, Darbond, Dover and Polychem UV/EB International Corp., etc. In terms of revenue, the global 3 largest players have a % market share of Soldering-type Conductive Paste in 2021.
Global Soldering-type Conductive Paste Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Soldering-type Conductive Paste Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Silver Conductive Paste
Copper Conductive Paste
Gold Conductive Paste
Segment by Application
Electronic Component
Ceramic Capacitor
Battery Material
Others
By Company
NAMICS Corporation
Dycotec Materials Ltd.
MITSUBOSHI
Henkel
CollTech
Yi Kun Glue
Darbond
Dover
Polychem UV/EB International Corp.
MG Chemicals
NTP
Diagnosys
Electron Microscopy Sciences
Parker Lord
PELNOX
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia