The assembly service segment is a highly dynamic industry. Vendors in the segment heavily invest in research and developmental activities to remain competitive. Within the SATS industry, a semiconductor assembly is also called an integrated circuit packaging or IC packages and encapsulation or sealing. SATS vendors are focusing on developing small packages and packaging materials that can provide high efficiency due to the spurt in smartphone sales and the demand for mobile devices. The segment will continue to grow throughout the projected period due to the rising demand for these high-end packaging solutions.
APAC is witnessing growth in the semiconductor assembly and testing services market due to the availability of cheap labor costs and proximity to various raw material supply sources. Being the major sources for raw material or intermediary component testing supply, countries such as Taiwan, China, Japan, and Singapore were the major contributors to the growth to the SATS industry in this region.
In 2018, the global Semiconductor Assembly and Testing Services market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

This report focuses on the global Semiconductor Assembly and Testing Services status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Semiconductor Assembly and Testing Services development in United States, Europe and China.

The key players covered in this study
Amkor Technology
ASE Group
Jiangsu Changjiang Electronics Technology (JCET)
Powertech Technology
Siliconware Precision Industries (SPIL)
Chipbond Technology
ChipMOS Technologies
FormFactor
Formosa Advanced Technologies
King Yuan Electronics
Lingsen Precision Industries
PSi Technologies
Signetics
Tessolve Semiconductor
Tianshui Huatian Technology
Unisem
UTAC

Market segment by Type, the product can be split into
Assembly Services
Testing Services

Market segment by Application, split into
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America

The study objectives of this report are:
To analyze global Semiconductor Assembly and Testing Services status, future forecast, growth opportunity, key market and key players.
To present the Semiconductor Assembly and Testing Services development in United States, Europe and China.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by product type, market and key regions.

In this study, the years considered to estimate the market size of Semiconductor Assembly and Testing Services are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.