This report studies the IC-Substrate market, IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.

Scope of the Report:
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Including Rigid Substrate, Flexible Substrate, Ceramic Substrates by Materials, and WB (wire bonding), FC (flip chip) IC-Substrate by packaging method. The IC-Substrate is mainly used for PC (Tablet, Laptop), Smart Phone, Wearable Devices and Other Devices. And PC (Tablet, Laptop) is the largest usage with the share of about 48%, followed by Smart Phone (35.5%).
The global average price of IC-Substrate is in the declining trend in 2012-2017, from about 817 $/m²in 2012 to 564 $/m² in 2016. And the price will be in declining trend while there are more and more players come.
Taiwan, Korea, Japan and China are the four largest sales market of IC-Substrate in the world in the past few years and it will keep the same position in the next years. And Japan is the largest customer of IC-Substrate in the world at present. Taiwan is the second largest market in the report with a consumption share of about 24% in 2016, followed by China with a share of 16%. Other key markets are Korea, USA, Europe, etc. which have the leading technology.
The worldwide market for IC-Substrate is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2024, from xx million US$ in 2019, according to a new study.
This report focuses on the IC-Substrate in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Ibiden
Shinko
Kyocera
Eastern
TTM Technologies
Unimicron
Kinsus
Nanya
ASE
Semco
LG Innotek
Simmtech
Daeduck
KCC（Korea Circuit Company）
Zhen Ding Technology
AT&S
Shennan Circuit
ACCESS
Shenzhen Fastprint Circuit Tech

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
WB BGA Substrate
WB CSP Substrate
FC BGA Substrate
FC CSP Substrate
Other Types

Market Segment by Applications, can be divided into
PC (Tablet, Laptop)
Smart Phone
Wearable Devices (smart watch)
Other Applications

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC-Substrate product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of IC-Substrate, with price, sales, revenue and global market share of IC-Substrate in 2017 and 2018.
Chapter 3, the IC-Substrate competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC-Substrate breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, IC-Substrate market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe IC-Substrate sales channel, distributors, customers, research findings and conclusion, appendix and data source.