1 3D IC & 2.5D IC Packaging Market Overview 1.1 Product Overview and Scope of 3D IC & 2.5D IC Packaging 1.2 3D IC & 2.5D IC Packaging Segment by Type 1.2.1 Global 3D IC & 2.5D IC Packaging Market Size Growth Rate Analysis by Type 2021 VS 2027 1.2.2 3D TSV 1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) 1.3 3D IC & 2.5D IC Packaging Segment by Application 1.3.1 Global 3D IC & 2.5D IC Packaging Consumption Comparison by Application: 2016 VS 2021 VS 2027 1.3.2 Automotive 1.3.3 Consumer electronics 1.3.4 Medical devices 1.3.5 Military & aerospace 1.3.6 Telecommunication 1.3.7 Industrial sector and smart technologies 1.4 Global Market Growth Prospects 1.4.1 Global 3D IC & 2.5D IC Packaging Revenue Estimates and Forecasts (2016-2027) 1.4.2 Global 3D IC & 2.5D IC Packaging Production Estimates and Forecasts (2016-2027) 1.5 Global Market Size by Region 1.5.1 Global 3D IC & 2.5D IC Packaging Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027 1.5.2 North America 3D IC & 2.5D IC Packaging Estimates and Forecasts (2016-2027) 1.5.3 Europe 3D IC & 2.5D IC Packaging Estimates and Forecasts (2016-2027) 1.5.4 China 3D IC & 2.5D IC Packaging Estimates and Forecasts (2016-2027) 1.5.5 Japan 3D IC & 2.5D IC Packaging Estimates and Forecasts (2016-2027) 1.5.6 South Korea 3D IC & 2.5D IC Packaging Estimates and Forecasts (2016-2027) 2 Market Competition by Manufacturers 2.1 Global 3D IC & 2.5D IC Packaging Production Market Share by Manufacturers (2016-2021) 2.2 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Manufacturers (2016-2021) 2.3 3D IC & 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3) 2.4 Global 3D IC & 2.5D IC Packaging Average Price by Manufacturers (2016-2021) 2.5 Manufacturers 3D IC & 2.5D IC Packaging Production Sites, Area Served, Product Types 2.6 3D IC & 2.5D IC Packaging Market Competitive Situation and Trends 2.6.1 3D IC & 2.5D IC Packaging Market Concentration Rate 2.6.2 Global 5 and 10 Largest 3D IC & 2.5D IC Packaging Players Market Share by Revenue 2.6.3 Mergers & Acquisitions, Expansion 3 Production and Capacity by Region 3.1 Global Production of 3D IC & 2.5D IC Packaging Market Share by Region (2016-2021) 3.2 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Region (2016-2021) 3.3 Global 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 3.4 North America 3D IC & 2.5D IC Packaging Production 3.4.1 North America 3D IC & 2.5D IC Packaging Production Growth Rate (2016-2021) 3.4.2 North America 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 3.5 Europe 3D IC & 2.5D IC Packaging Production 3.5.1 Europe 3D IC & 2.5D IC Packaging Production Growth Rate (2016-2021) 3.5.2 Europe 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 3.6 China 3D IC & 2.5D IC Packaging Production 3.6.1 China 3D IC & 2.5D IC Packaging Production Growth Rate (2016-2021) 3.6.2 China 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 3.7 Japan 3D IC & 2.5D IC Packaging Production 3.7.1 Japan 3D IC & 2.5D IC Packaging Production Growth Rate (2016-2021) 3.7.2 Japan 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 3.8 South Korea 3D IC & 2.5D IC Packaging Production 3.8.1 South Korea 3D IC & 2.5D IC Packaging Production Growth Rate (2016-2021) 3.8.2 South Korea 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 4 Global 3D IC & 2.5D IC Packaging Consumption by Region 4.1 Global 3D IC & 2.5D IC Packaging Consumption by Region 4.1.1 Global 3D IC & 2.5D IC Packaging Consumption by Region 4.1.2 Global 3D IC & 2.5D IC Packaging Consumption Market Share by Region 4.2 North America 4.2.1 North America 3D IC & 2.5D IC Packaging Consumption by Country 4.2.2 U.S. 4.2.3 Canada 4.3 Europe 4.3.1 Europe 3D IC & 2.5D IC Packaging Consumption by Country 4.3.2 Germany 4.3.3 France 4.3.4 U.K. 4.3.5 Italy 4.3.6 Russia 4.4 Asia Pacific 4.4.1 Asia Pacific 3D IC & 2.5D IC Packaging Consumption by Region 4.4.2 China 4.4.3 Japan 4.4.4 South Korea 4.4.5 Taiwan 4.4.6 Southeast Asia 4.4.7 India 4.4.8 Australia 4.5 Latin America 4.5.1 Latin America 3D IC & 2.5D IC Packaging Consumption by Country 4.5.2 Mexico 4.5.3 Brazil 5 Production, Revenue, Price Trend by Type 5.1 Global 3D IC & 2.5D IC Packaging Production Market Share by Type (2016-2021) 5.2 Global 3D IC & 2.5D IC Packaging Revenue Market Share by Type (2016-2021) 5.3 Global 3D IC & 2.5D IC Packaging Price by Type (2016-2021) 6 Consumption Analysis by Application 6.1 Global 3D IC & 2.5D IC Packaging Consumption Market Share by Application (2016-2021) 6.2 Global 3D IC & 2.5D IC Packaging Consumption Growth Rate by Application (2016-2021) 7 Key Companies Profiled 7.1 Intel Corporation 7.1.1 Intel Corporation 3D IC & 2.5D IC Packaging Corporation Information 7.1.2 Intel Corporation 3D IC & 2.5D IC Packaging Product Portfolio 7.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.1.4 Intel Corporation Main Business and Markets Served 7.1.5 Intel Corporation Recent Developments/Updates 7.2 Toshiba Corp 7.2.1 Toshiba Corp 3D IC & 2.5D IC Packaging Corporation Information 7.2.2 Toshiba Corp 3D IC & 2.5D IC Packaging Product Portfolio 7.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.2.4 Toshiba Corp Main Business and Markets Served 7.2.5 Toshiba Corp Recent Developments/Updates 7.3 Samsung Electronics 7.3.1 Samsung Electronics 3D IC & 2.5D IC Packaging Corporation Information 7.3.2 Samsung Electronics 3D IC & 2.5D IC Packaging Product Portfolio 7.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.3.4 Samsung Electronics Main Business and Markets Served 7.3.5 Samsung Electronics Recent Developments/Updates 7.4 Stmicroelectronics 7.4.1 Stmicroelectronics 3D IC & 2.5D IC Packaging Corporation Information 7.4.2 Stmicroelectronics 3D IC & 2.5D IC Packaging Product Portfolio 7.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.4.4 Stmicroelectronics Main Business and Markets Served 7.4.5 Stmicroelectronics Recent Developments/Updates 7.5 Taiwan Semiconductor Manufacturing 7.5.1 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Corporation Information 7.5.2 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Portfolio 7.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.5.4 Taiwan Semiconductor Manufacturing Main Business and Markets Served 7.5.5 Taiwan Semiconductor Manufacturing Recent Developments/Updates 7.6 Amkor Technology 7.6.1 Amkor Technology 3D IC & 2.5D IC Packaging Corporation Information 7.6.2 Amkor Technology 3D IC & 2.5D IC Packaging Product Portfolio 7.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.6.4 Amkor Technology Main Business and Markets Served 7.6.5 Amkor Technology Recent Developments/Updates 7.7 United Microelectronics 7.7.1 United Microelectronics 3D IC & 2.5D IC Packaging Corporation Information 7.7.2 United Microelectronics 3D IC & 2.5D IC Packaging Product Portfolio 7.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.7.4 United Microelectronics Main Business and Markets Served 7.7.5 United Microelectronics Recent Developments/Updates 7.8 Broadcom 7.8.1 Broadcom 3D IC & 2.5D IC Packaging Corporation Information 7.8.2 Broadcom 3D IC & 2.5D IC Packaging Product Portfolio 7.8.3 Broadcom 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.8.4 Broadcom Main Business and Markets Served 7.7.5 Broadcom Recent Developments/Updates 7.9 ASE Group 7.9.1 ASE Group 3D IC & 2.5D IC Packaging Corporation Information 7.9.2 ASE Group 3D IC & 2.5D IC Packaging Product Portfolio 7.9.3 ASE Group 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.9.4 ASE Group Main Business and Markets Served 7.9.5 ASE Group Recent Developments/Updates 7.10 Pure Storage 7.10.1 Pure Storage 3D IC & 2.5D IC Packaging Corporation Information 7.10.2 Pure Storage 3D IC & 2.5D IC Packaging Product Portfolio 7.10.3 Pure Storage 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.10.4 Pure Storage Main Business and Markets Served 7.10.5 Pure Storage Recent Developments/Updates 7.11 Advanced Semiconductor Engineering 7.11.1 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Corporation Information 7.11.2 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Portfolio 7.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Production, Revenue, Price and Gross Margin (2016-2021) 7.11.4 Advanced Semiconductor Engineering Main Business and Markets Served 7.11.5 Advanced Semiconductor Engineering Recent Developments/Updates 8 3D IC & 2.5D IC Packaging Manufacturing Cost Analysis 8.1 3D IC & 2.5D IC Packaging Key Raw Materials Analysis 8.1.1 Key Raw Materials 8.1.2 Key Raw Materials Price Trend 8.1.3 Key Suppliers of Raw Materials 8.2 Proportion of Manufacturing Cost Structure 8.3 Manufacturing Process Analysis of 3D IC & 2.5D IC Packaging 8.4 3D IC & 2.5D IC Packaging Industrial Chain Analysis 9 Marketing Channel, Distributors and Customers 9.1 Marketing Channel 9.2 3D IC & 2.5D IC Packaging Distributors List 9.3 3D IC & 2.5D IC Packaging Customers 10 Market Dynamics 10.1 3D IC & 2.5D IC Packaging Industry Trends 10.2 3D IC & 2.5D IC Packaging Growth Drivers 10.3 3D IC & 2.5D IC Packaging Market Challenges 10.4 3D IC & 2.5D IC Packaging Market Restraints 11 Production and Supply Forecast 11.1 Global Forecasted Production of 3D IC & 2.5D IC Packaging by Region (2022-2027) 11.2 North America 3D IC & 2.5D IC Packaging Production, Revenue Forecast (2022-2027) 11.3 Europe 3D IC & 2.5D IC Packaging Production, Revenue Forecast (2022-2027) 11.4 China 3D IC & 2.5D IC Packaging Production, Revenue Forecast (2022-2027) 11.5 Japan 3D IC & 2.5D IC Packaging Production, Revenue Forecast (2022-2027) 11.6 South Korea 3D IC & 2.5D IC Packaging Production, Revenue Forecast (2022-2027) 12 Consumption and Demand Forecast 12.1 Global Forecasted Demand Analysis of 3D IC & 2.5D IC Packaging 12.2 North America Forecasted Consumption of 3D IC & 2.5D IC Packaging by Country 12.3 Europe Market Forecasted Consumption of 3D IC & 2.5D IC Packaging by Country 12.4 Asia Pacific Market Forecasted Consumption of 3D IC & 2.5D IC Packaging by Region 12.5 Latin America Forecasted Consumption of 3D IC & 2.5D IC Packaging by Country 13 Forecast by Type and by Application (2022-2027) 13.1 Global Production, Revenue and Price Forecast by Type (2022-2027) 13.1.1 Global Forecasted Production of 3D IC & 2.5D IC Packaging by Type (2022-2027) 13.1.2 Global Forecasted Revenue of 3D IC & 2.5D IC Packaging by Type (2022-2027) 13.1.3 Global Forecasted Price of 3D IC & 2.5D IC Packaging by Type (2022-2027) 13.2 Global Forecasted Consumption of 3D IC & 2.5D IC Packaging by Application (2022-2027) 14 Research Finding and Conclusion 15 Methodology and Data Source 15.1 Methodology/Research Approach 15.1.1 Research Programs/Design 15.1.2 Market Size Estimation 15.1.3 Market Breakdown and Data Triangulation 15.2 Data Source 15.2.1 Secondary Sources 15.2.2 Primary Sources 15.3 Author List 15.4 Disclaimer

List of Tables Table 1. Global 3D IC & 2.5D IC Packaging Market Size by Type (K Units) & (US$ Million) (2021 VS 2027) Table 2. Global 3D IC & 2.5D IC Packaging Consumption (K Units) Comparison by Application: 2016 VS 2021 VS 2027 Table 3. 3D IC & 2.5D IC Packaging Market Size Comparison by Region: 2016 VS 2021 VS 2027 Table 4. Global 3D IC & 2.5D IC Packaging Production (K Units) by Manufacturers Table 5. Global 3D IC & 2.5D IC Packaging Production (K Units) by Manufacturers (2016-2021) Table 6. Global 3D IC & 2.5D IC Packaging Production Market Share by Manufacturers (2016-2021) Table 7. Global 3D IC & 2.5D IC Packaging Revenue (US$ Million) by Manufacturers (2016-2021) Table 8. Global 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2016-2021) Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 3D IC & 2.5D IC Packaging as of 2020) Table 10. Global Market 3D IC & 2.5D IC Packaging Average Price (USD/Unit) of Key Manufacturers (2016-2021) Table 11. Manufacturers 3D IC & 2.5D IC Packaging Production Sites and Area Served Table 12. Manufacturers 3D IC & 2.5D IC Packaging Product Types Table 13. Mergers & Acquisitions, Expansion Table 14. Global 3D IC & 2.5D IC Packaging Production (K Units) by Region (2016-2021) Table 15. Global 3D IC & 2.5D IC Packaging Revenue (US$ Million) by Region (2016-2021) Table 16. Global 3D IC & 2.5D IC Packaging Revenue Market Share by Region (2016-2021) Table 17. Global 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 18. North America 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 19. Europe 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 20. China 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 21. Japan 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 22. South Korea 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 23. Global 3D IC & 2.5D IC Packaging Consumption Market by Region (2016-2021) & (K Units) Table 24. Global 3D IC & 2.5D IC Packaging Consumption Market Share by Region (2016-2021) Table 25. North America 3D IC & 2.5D IC Packaging Consumption by Country (2016-2021) & (K Units) Table 26. Europe 3D IC & 2.5D IC Packaging Consumption by Country (2016-2021) & (K Units) Table 27. Asia Pacific 3D IC & 2.5D IC Packaging Consumption by Region (2016-2021) & (K Units) Table 28. Latin America 3D IC & 2.5D IC Packaging Consumption by Countries (2016-2021) & (K Units) Table 29. Global 3D IC & 2.5D IC Packaging Production (K Units) by Type (2016-2021) Table 30. Global 3D IC & 2.5D IC Packaging Production Market Share by Type (2016-2021) Table 31. Global 3D IC & 2.5D IC Packaging Revenue (US$ Million) by Type (2016-2021) Table 32. Global 3D IC & 2.5D IC Packaging Revenue Share by Type (2016-2021) Table 33. Global 3D IC & 2.5D IC Packaging Price (USD/Unit) by Type (2016-2021) Table 34. Global 3D IC & 2.5D IC Packaging Consumption by Application (2016-2021) & (K Units) Table 35. Global 3D IC & 2.5D IC Packaging Consumption Market Share by Application (2016-2021) Table 36. Global 3D IC & 2.5D IC Packaging Consumption Growth Rate by Application (2016-2021) Table 37. Intel Corporation 3D IC & 2.5D IC Packaging Corporation Information Table 38. Intel Corporation Specification and Application Table 39. Intel Corporation 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 40. Intel Corporation Main Business and Markets Served Table 41. Intel Corporation Recent Developments/Updates Table 42. Toshiba Corp 3D IC & 2.5D IC Packaging Corporation Information Table 43. Toshiba Corp Specification and Application Table 44. Toshiba Corp 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 45. Toshiba Corp Main Business and Markets Served Table 46. Toshiba Corp Recent Developments/Updates Table 47. Samsung Electronics 3D IC & 2.5D IC Packaging Corporation Information Table 48. Samsung Electronics Specification and Application Table 49. Samsung Electronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 50. Samsung Electronics Main Business and Markets Served Table 51. Samsung Electronics Recent Developments/Updates Table 52. Stmicroelectronics 3D IC & 2.5D IC Packaging Corporation Information Table 53. Stmicroelectronics Specification and Application Table 54. Stmicroelectronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 55. Stmicroelectronics Main Business and Markets Served Table 56. Stmicroelectronics Recent Developments/Updates Table 57. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Corporation Information Table 58. Taiwan Semiconductor Manufacturing Specification and Application Table 59. Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 60. Taiwan Semiconductor Manufacturing Main Business and Markets Served Table 61. Taiwan Semiconductor Manufacturing Recent Developments/Updates Table 62. Amkor Technology 3D IC & 2.5D IC Packaging Corporation Information Table 63. Amkor Technology Specification and Application Table 64. Amkor Technology 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 65. Amkor Technology Main Business and Markets Served Table 66. Amkor Technology Recent Developments/Updates Table 67. United Microelectronics 3D IC & 2.5D IC Packaging Corporation Information Table 68. United Microelectronics Specification and Application Table 69. United Microelectronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 70. United Microelectronics Main Business and Markets Served Table 71. United Microelectronics Recent Developments/Updates Table 72. Broadcom 3D IC & 2.5D IC Packaging Corporation Information Table 73. Broadcom Specification and Application Table 74. Broadcom 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 75. Broadcom Main Business and Markets Served Table 76. Broadcom Recent Developments/Updates Table 77. ASE Group 3D IC & 2.5D IC Packaging Corporation Information Table 78. ASE Group Specification and Application Table 79. ASE Group 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 80. ASE Group Main Business and Markets Served Table 81. ASE Group Recent Developments/Updates Table 82. Pure Storage 3D IC & 2.5D IC Packaging Corporation Information Table 83. Pure Storage Specification and Application Table 84. Pure Storage 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 85. Pure Storage Main Business and Markets Served Table 86. Pure Storage Recent Developments/Updates Table 87. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Corporation Information Table 88. Advanced Semiconductor Engineering Specification and Application Table 89. Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Production (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2016-2021) Table 90. Advanced Semiconductor Engineering Main Business and Markets Served Table 91. Advanced Semiconductor Engineering Recent Developments/Updates Table 92. Production Base and Market Concentration Rate of Raw Material Table 93. Key Suppliers of Raw Materials Table 94. 3D IC & 2.5D IC Packaging Distributors List Table 95. 3D IC & 2.5D IC Packaging Customers List Table 96. 3D IC & 2.5D IC Packaging Market Trends Table 97. 3D IC & 2.5D IC Packaging Growth Drivers Table 98. 3D IC & 2.5D IC Packaging Market Challenges Table 99. 3D IC & 2.5D IC Packaging Market Restraints Table 100. Global 3D IC & 2.5D IC Packaging Production (K Units) Forecast by Region (2022-2027) Table 101. North America 3D IC & 2.5D IC Packaging Consumption Forecast by Country (2022-2027) & (K Units) Table 102. Europe 3D IC & 2.5D IC Packaging Consumption Forecast by Country (2022-2027) & (K Units) Table 103. Asia Pacific 3D IC & 2.5D IC Packaging Consumption Forecast by Region (2022-2027) & (K Units) Table 104. Latin America 3D IC & 2.5D IC Packaging Consumption Forecast by Country (2022-2027) & (K Units) Table 105. Global 3D IC & 2.5D IC Packaging Production Forecast by Type (2022-2027) & (K Units) Table 106. Global 3D IC & 2.5D IC Packaging Revenue Forecast by Type (2022-2027) & (US$ Million) Table 107. Global 3D IC & 2.5D IC Packaging Price Forecast by Type (2022-2027) & (USD/Unit) Table 108. Global 3D IC & 2.5D IC Packaging Consumption (K Units) Forecast by Application (2022-2027) Table 109. Research Programs/Design for This Report Table 110. Key Data Information from Secondary Sources Table 111. Key Data Information from Primary Sources List of Figures Figure 1. Product Picture of 3D IC & 2.5D IC Packaging Figure 2. Global 3D IC & 2.5D IC Packaging Market Share by Type: 2020 VS 2027 Figure 3. 3D TSV Product Picture Figure 4. 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Product Picture Figure 5. Global 3D IC & 2.5D IC Packaging Market Share by Application: 2020 VS 2027 Figure 6. Automotive Figure 7. Consumer electronics Figure 8. Medical devices Figure 9. Military & aerospace Figure 10. Telecommunication Figure 11. Industrial sector and smart technologies Figure 12. Global 3D IC & 2.5D IC Packaging Revenue (US$ Million), 2016 VS 2021 VS 2027 Figure 13. Global 3D IC & 2.5D IC Packaging Revenue (US$ Million) (2016-2027) Figure 14. Global 3D IC & 2.5D IC Packaging Production (K Units) & (2016-2027) Figure 15. North America 3D IC & 2.5D IC Packaging Revenue (US$ Million) and Growth Rate (2016-2027) Figure 16. Europe 3D IC & 2.5D IC Packaging Revenue (US$ Million) and Growth Rate (2016-2027) Figure 17. China 3D IC & 2.5D IC Packaging Revenue (US$ Million) and Growth Rate (2016-2027) Figure 18. Japan 3D IC & 2.5D IC Packaging Revenue (US$ Million) and Growth Rate (2016-2027) Figure 19. South Korea 3D IC & 2.5D IC Packaging Revenue (US$ Million) and Growth Rate (2016-2027) Figure 20. 3D IC & 2.5D IC Packaging Production Share by Manufacturers in 2020 Figure 21. Global 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers in 2020 Figure 22. 3D IC & 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2016 VS 2020 Figure 23. Global Market 3D IC & 2.5D IC Packaging Average Price (USD/Unit) of Key Manufacturers in 2020 Figure 24. The Global 5 and 10 Largest Players: Market Share by 3D IC & 2.5D IC Packaging Revenue in 2020 Figure 25. Global 3D IC & 2.5D IC Packaging Production Market Share by Region (2016-2021) Figure 26. North America 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate (2016-2021) Figure 27. Europe 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate (2016-2021) Figure 28. China 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate (2016-2021) Figure 29. Japan 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate (2016-2021) Figure 30. South Korea 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate (2016-2021) Figure 31. Global 3D IC & 2.5D IC Packaging Consumption Market Share by Region (2016-2021) Figure 32. Global 3D IC & 2.5D IC Packaging Consumption Market Share by Region in 2020 Figure 33. North America 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 34. North America 3D IC & 2.5D IC Packaging Consumption Market Share by Country in 2020 Figure 35. Canada 3D IC & 2.5D IC Packaging Consumption Growth Rate (2016-2021) & (K Units) Figure 36. U.S. 3D IC & 2.5D IC Packaging Consumption Growth Rate (2016-2021) & (K Units) Figure 37. Europe 3D IC & 2.5D IC Packaging Consumption Growth Rate (2016-2021) & (K Units) Figure 38. Europe 3D IC & 2.5D IC Packaging Consumption Market Share by Country in 2020 Figure 39. Germany America 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 40. France 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 41. U.K. 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 42. Italy 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 43. Russia 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 44. Asia Pacific 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 45. Asia Pacific 3D IC & 2.5D IC Packaging Consumption Market Share by Regions in 2020 Figure 46. China 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 47. Japan 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 48. South Korea 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 49. Taiwan 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 50. Southeast Asia 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 51. India 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 52. Australia 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 53. Latin America 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 54. Latin America 3D IC & 2.5D IC Packaging Consumption Market Share by Country in 2020 Figure 55. Mexico 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 56. Brazil 3D IC & 2.5D IC Packaging Consumption and Growth Rate (2016-2021) & (K Units) Figure 57. Production Market Share of 3D IC & 2.5D IC Packaging by Type (2016-2021) Figure 58. Production Market Share of 3D IC & 2.5D IC Packaging by Type in 2020 Figure 59. Revenue Share of 3D IC & 2.5D IC Packaging by Type (2016-2021) Figure 60. Revenue Market Share of 3D IC & 2.5D IC Packaging by Type in 2020 Figure 61. Global 3D IC & 2.5D IC Packaging Consumption Market Share by Application (2016-2021) Figure 62. Global 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2020 Figure 63. Global 3D IC & 2.5D IC Packaging Consumption Growth Rate by Application (2016-2021) Figure 64. Key Raw Materials Price Trend Figure 65. Manufacturing Cost Structure of 3D IC & 2.5D IC Packaging Figure 66. Manufacturing Process Analysis of 3D IC & 2.5D IC Packaging Figure 67. 3D IC & 2.5D IC Packaging Industrial Chain Analysis Figure 68. Channels of Distribution Figure 69. Distributors Profiles Figure 70. Global 3D IC & 2.5D IC Packaging Production Market Share Forecast by Region (2022-2027) Figure 71. North America 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate Forecast (2022-2027) Figure 72. Europe 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate Forecast (2022-2027) Figure 73. China 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate Forecast (2022-2027) Figure 74. Japan 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate Forecast (2022-2027) Figure 75. South Korea 3D IC & 2.5D IC Packaging Production (K Units) Growth Rate Forecast (2022-2027) Figure 76. Global Forecasted Demand Analysis of 3D IC & 2.5D IC Packaging (2015-2027) & (K Units) Figure 77. Global 3D IC & 2.5D IC Packaging Production Market Share Forecast by Type (2022-2027) Figure 78. Global 3D IC & 2.5D IC Packaging Revenue Market Share Forecast by Type (2022-2027) Figure 79. Global 3D IC & 2.5D IC Packaging Consumption Forecast by Application (2022-2027) Figure 80. Bottom-up and Top-down Approaches for This Report Figure 81. Data Triangulation

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