PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT PART 03: RESEARCH METHODOLOGY PART 04: MARKET LANDSCAPE • Market ecosystem • Market characteristics • Market segmentation analysis PART 05: MARKET SIZING • Market definition • Market sizing 2017 • Market size and forecast 2017-2022 PART 06: FIVE FORCES ANALYSIS • Bargaining power of buyers • Bargaining power of suppliers • Threat of new entrants • Threat of substitutes • Threat of rivalry • Market condition PART 07: MARKET SEGMENTATION BY APPLICATION • Segmentation by application • Comparison by application • Rugged mobile computers – Market size and forecast 2017-2022 • Rugged tablets – Market size and forecast 2017-2022 • Rugged scanners – Market size and forecast 2017-2022 • Others – Market size and forecast 2017-2022 • Market opportunity by application PART 08: CUSTOMER LANDSCAPE PART 09: REGIONAL LANDSCAPE • Geographical segmentation • Regional comparison • Americas – Market size and forecast 2017-2022 • EMEA – Market size and forecast 2017-2022 • APAC – Market size and forecast 2017-2022 • Key leading countries • Market opportunity PART 10: DECISION FRAMEWORK PART 11: DRIVERS AND CHALLENGES • Market drivers • Market challenges PART 12: MARKET TRENDS • Growth of rugged IoT • Increased deployment of UAVs by defense and military • Adoption of modular data center PART 13: VENDOR LANDSCAPE • Overview • Landscape disruption PART 14: VENDOR ANALYSIS • Vendors covered • Vendor classification • Market positioning of vendors • Analog Devices • Honeywell International • Infineon Technologies • Ozark Integrated Circuits • STMicroelectronics • List of abbreviations     Exhibit 01: Parent market Exhibit 02: Segmentation of global semiconductor market Exhibit 03: Market characteristics Exhibit 04: Market segments Exhibit 05: Market definition - Inclusions and exclusions checklist Exhibit 06: Market size 2017 Exhibit 07: Validation techniques employed for market sizing 2017 Exhibit 08: Global rugged IC market – Market size and forecast 2017-2022 ($ bn) Exhibit 09: Unit shipments of rugged devices 2017-2022 (millions of units) Exhibit 10: Global rugged IC market – Year-over-year growth 2018-2022 (%) Exhibit 11: Five forces analysis 2017 Exhibit 12: Five forces analysis 2022 Exhibit 13: Bargaining power of buyers Exhibit 14: Bargaining power of suppliers Exhibit 15: Threat of new entrants Exhibit 16: Threat of substitutes Exhibit 17: Threat of rivalry Exhibit 18: Market condition - Five forces 2017 Exhibit 19: Global rugged IC market by application – Market share 2017-2022 (%) Exhibit 20: Comparison by application Exhibit 21: Rugged mobile computers – Market size and forecast 2017-2022 ($ bn) Exhibit 22: Rugged mobile computers – Year-over-year growth 2018-2022 (%) Exhibit 23: Rugged tablets – Market size and forecast 2017-2022 ($ bn) Exhibit 24: Rugged tablets – Year-over-year growth 2018-2022 (%) Exhibit 25: Rugged scanners – Market size and forecast 2017-2022 ($ bn) Exhibit 26: Rugged scanners – Year-over-year growth 2018-2022 (%) Exhibit 27: Others – Market size and forecast 2017-2022 ($ bn) Exhibit 28: Others – Year-over-year growth 2018-2022 (%) Exhibit 29: Market opportunity by application Exhibit 30: Customer landscape Exhibit 31: Global rugged IC market by geography – Market share 2017-2022 (%) Exhibit 32: Regional comparison Exhibit 33: Americas – Market size and forecast 2017-2022 ($ bn) Exhibit 34: Americas – Year-over-year growth 2018-2022 (%) Exhibit 35: EMEA – Market size and forecast 2017-2022 ($ bn) Exhibit 36: EMEA – Year-over-year growth 2018-2022 (%) Exhibit 37: APAC – Market size and forecast 2017-2022 ($ bn) Exhibit 38: APAC – Year-over-year growth 2018-2022 (%) Exhibit 39: Key leading countries Exhibit 40: Market opportunity Exhibit 41: Global semiconductor market trend 1992-2017 ($ billions) Exhibit 42: Vendor landscape Exhibit 43: Landscape disruption Exhibit 44: Vendors covered Exhibit 45: Vendor classification Exhibit 46: Market positioning of vendors Exhibit 47: Vendor overview Exhibit 48: Analog Devices – Business segments Exhibit 49: Analog Devices – Organizational developments Exhibit 50: Analog Devices – Geographic focus Exhibit 51: Analog Devices – Segment focus Exhibit 52: Analog Devices – Key offerings Exhibit 53: Vendor overview Exhibit 54: Honeywell International – Business segments Exhibit 55: Honeywell International – Organizational developments Exhibit 56: Honeywell International – Geographic focus Exhibit 57: Honeywell International – Segment focus Exhibit 58: Honeywell International – Key offerings Exhibit 59: Vendor overview Exhibit 60: Infineon Technologies – Business segments Exhibit 61: Infineon Technologies – Organizational developments Exhibit 62: Infineon Technologies – Geographic focus Exhibit 63: Infineon Technologies – Segment focus Exhibit 64: Infineon Technologies – Key offerings Exhibit 65: Vendor overview Exhibit 66: Ozark Integrated Circuits – Organizational developments Exhibit 67: Ozark Integrated Circuits – Key offerings Exhibit 68: Vendor overview Exhibit 69: STMicroelectronics – Business segments Exhibit 70: STMicroelectronics – Organizational developments Exhibit 71: STMicroelectronics – Geographic focus Exhibit 72: STMicroelectronics – Segment focus Exhibit 73: STMicroelectronics – Key offerings    

Analog Devices Honeywell International Infineon Technologies Ozark Integrated Circuits and STMicroelectronics