Chemicals

2014-2026 Global Smart Packaging Industry Market Research Report, Segment by Player, Type, Application, Marketing Channel, and Region

SKU ID :Maia-15086260 | Published Date: 14-Jan-2020 | No. of pages: 139

Description

The worldwide market for Smart Packaging is estimated to grow at a CAGR of roughly X.X% in the next 8 years, and will reach X.X million US$ in 2026, from X.X million US$ in 2019.

The report covers market size status and forecast, value chain analysis, market segmentation of Top countries in

Major Region

s, such as North America, Europe, Asia-Pacific, Latin America and Middle East & Africa, by type, application and marketing channel. In addition, the report focuses on the driving factors, restraints, opportunities and PEST analysis of major regions.

Major Companies Covered
Bemis Company, Inc.
PakSense
3M
Rexam PLC
Avery Dennison Corp.
Constar International Inc.
Crown Holdings Inc.
American Thermal Instruments
Multisorb Technologies
BASF SE
R.R. Donnelly Sons & Company
Graham Packaging Company Inc.
Thin Film Electronics ASA
Sysco Corporation (Fresh Point Services)
Ball Corporation
TempTime Corporation
Ampacet Corporation
Stora Enso
Timestrip, PLC
International Paper

Major Types Covered
Active Packaging
Intelligent Packaging

Major Applications Covered
Food
Beverage
Healthcare
Personal Care
Other End-user Verticals

Top Countries Data Covered in This Report
United States
Canada
Germany
UK
France
Italy
Spain
Russia
Netherlands
Turkey
Switzerland
Sweden
Poland
Belgium
China
Japan
South Korea
Australia
India
Taiwan
Indonesia
Thailand
Philippines
Malaysia
Brazil
Mexico
Argentina
Columbia
Chile
Saudi Arabia
UAE
Egypt
Nigeria
South Africa
…