2021-2027 Global and Regional Flip Chip Bonder Industry Status and Prospects Professional Market Research Report Standard Version

The global Flip Chip Bonder market was valued at 2051.71 Million USD in 2020 and will grow with a CAGR of 3.59% from 2020 to 2027, based on HNY Research newly published report.

The prime objective of this report is to provide the insights on the post COVID-19 impact which will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:1. Die is picked up and place on a "flipping device" 2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions 3. The tool then places the die on the bump with a programmed amount of force Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support. Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method. The world leading enterprise in the Flip Chip Bonder market are Besi (NL), which followed by ASMPT (HK), Shibaura (JP), Muehlbauer (DE), K&S (US), Hanmi (KR), AMICRA (DE), SET (FR), and Athlete FA (JP). These Top companies currently account for more than 97% of the total market share. From the perspective of product classification, Flip Chip Bonder has two categories: full-automatic and semi-automatic. In 2019, the full-automatic type accounts for about 76% of the total market share and occupies a dominant position in the product market.

By Market Verdors:

BESI

ASMPT

Shibaura

Muehlbauer

K&S

Hamni

AMICRA Microtechnologies

SET

Athlete FA

By Type

s:

IDMs

OSAT

By Application

s:

Fully Automatic

Semi-Automatic



Key Indicators Analysed

Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.

Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.

Market Trends: Market key trends which include Increased Competition and Continuous Innovations.

Opportunities and Drivers: Identifying the Growing Demands and New Technology

Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

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