2020-2025 Global Lead-Free Solder Paste Market Report - Production and Consumption Professional Analysis (Impact of COVID-19)

Lead-free solder paste is a solder paste without contain lead. Solder paste is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe and then the components are put in place by a pick-and-place machine or by hand.
This report elaborates the market size, market characteristics, and market growth of the Lead-Free Solder Paste industry, and breaks down according to the type, application, and consumption area of Lead-Free Solder Paste. The report also conducted a PESTEL analysis of the industry to study the main influencing factors and entry barriers of the industry.

In Chapter 3.4 of the report, the impact of the COVID-19 outbreak on the industry was fully assessed. Fully risk assessment and industry recommendations were made for Lead-Free Solder Paste in a special period. This chapter also compares the markets of Pre COVID-19 and Post COVID-19.
In addition, chapters 8-12 consider the impact of COVID-19 on the regional economy.

Key players in the global Lead-Free Solder Paste market covered in Chapter 13:
Indium Corporation
MG Chemicals
Shenzhen Bright
Weiteou
Interflux Electronics
Yashida
Balver Zinn Josef Jost
DongGuan Legret Metal
Tianjin Songben
Yanktai Microelectronic Material
Nihon Almit
KOKI
Zhongya Electronic Solder
Henkel AG & Co
Tamura
AMTECH
Union Soltek Group
Nordson
Uchihashi Estec
Chengxing Group
Tongfang Tech
Nihon Genma Mfg
Senju Metal Industry
Huaqing Solder
Alpha
Nihon Superior
AIM Solder
Qualitek
Guangchen Metal Products
Kester

In Chapter 6, on the basis of types, the Lead-Free Solder Paste market from 2015 to 2025 is primarily split into:
Low-Temperature Lead-Free Solder Paste
Middle and Low-Temperature Lead-Free Solder Paste
Middle -Temperature Lead-Free Solder Paste
High-Temperature Lead-Free Solder Paste

In Chapter 7, on the basis of applications, the Lead-Free Solder Paste market from 2015 to 2025 covers:
Wire Board
PCB Board
SMT
Other

Geographically, the detailed analysis of production, trade of the following countries is covered in Chapter 4.2, 5:
United States
Europe
China
Japan
India

Geographically, the detailed analysis of consumption, revenue, market share and growth rate of the following regions are covered in Chapter 8, 9, 10, 11, 12:
North America (Covered in Chapter 8)
United States
Canada
Mexico
Europe (Covered in Chapter 9)
Germany
UK
France
Italy
Spain
Others
Asia-Pacific (Covered in Chapter 10)
China
Japan
India
South Korea
Southeast Asia
Others
Middle East and Africa (Covered in Chapter 11)
Saudi Arabia
UAE
South Africa
Others
South America (Covered in Chapter 12)
Brazil
Others

Years considered for this report:

Historical Years:

2015-2019

Base Year:

2019

Estimated Year:

2020

Forecast Period:

2020-2025