2014-2026 Global Wafer Grinding Equipment Industry Market Research Report, Segment by Player, Type, Application, Marketing Channel, and Region

The worldwide market for Wafer Grinding Equipment is estimated to grow at a CAGR of roughly X.X% in the next 8 years, and will reach X.X million US$ in 2026, from X.X million US$ in 2019.

The report covers market size status and forecast, value chain analysis, market segmentation of Top countries in

Major Region

s, such as North America, Europe, Asia-Pacific, Latin America and Middle East & Africa, by type, application and marketing channel. In addition, the report focuses on the driving factors, restraints, opportunities and PEST analysis of major regions.

Major Companies Covered
Okamoto Semiconductor Equipment Division
GigaMat
ACCRETECH
Disco
SpeedFam
Koyo Machinery
Komatsu NTC
Hunan Yujing Machine Industrial
Daitron
Arnold Gruppe
WAIDA MFG
MAT Inc
Dikema Presicion Machinery
G&N Genauigkeits Maschinenbau Nürnberg GmbH
Dynavest
Strasbaugh


Major Types Covered
Wafer Edge Grinder
Wafer Surface Grinder

Major Applications Covered
Semiconductor
Photovoltaic

Top Countries Data Covered in This Report
United States
Canada
Germany
UK
France
Italy
Spain
Russia
Netherlands
Turkey
Switzerland
Sweden
Poland
Belgium
China
Japan
South Korea
Australia
India
Taiwan
Indonesia
Thailand
Philippines
Malaysia
Brazil
Mexico
Argentina
Columbia
Chile
Saudi Arabia
UAE
Egypt
Nigeria
South Africa
…

Years considered for this report:

Historical Years:

2014-2018

Base Year:

2019

Estimated Year:

2019

Forecast Period:

2019-2026