Global Through Glass Via (TGV) Wafer Market Size, Status and Forecast 2020-2026

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking in 2019. Corning accounted for 26.90% of the Global Through Glass Via (TGV) Wafer Production Value market share in 2018. Other players accounted for 21.49%, 11.93% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.
Market Analysis and Insights: Global Through Glass Via (TGV) Wafer Market
In 2019, the global Through Glass Via (TGV) Wafer market size was US$ 31 million and it is expected to reach US$ 281.4 million by the end of 2026, with a CAGR of 36.7% during 2021-2026.
Global Through Glass Via (TGV) Wafer Scope and Market Size
Through Glass Via (TGV) Wafer market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Through Glass Via (TGV) Wafer market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2015-2026.
Segment by Type, the Through Glass Via (TGV) Wafer market is segmented into 300 mm, 200 mm, Below150 mm, etc.
Segment by Application, the Through Glass Via (TGV) Wafer market is segmented into Biotechnology/Medical, Consumer Electronics, Automotive, Others, etc.
Regional and Country-level Analysis
The Through Glass Via (TGV) Wafer market is analysed and market size information is provided by regions (countries).
The key regions covered in the Through Glass Via (TGV) Wafer market report are United States, Europe and Japan, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of revenue for the period 2015-2026.

Competitive Landscape

and Through Glass Via (TGV) Wafer Market Share Analysis
Through Glass Via (TGV) Wafer market competitive landscape provides details and data information by vendors. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by player for the period 2015-2020. Details included are company description, major business, company total revenue and the revenue generated in Through Glass Via (TGV) Wafer business, the date to enter into the Through Glass Via (TGV) Wafer market, Through Glass Via (TGV) Wafer product introduction, recent developments, etc.
The major vendors include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, etc.

This report focuses on the global Through Glass Via (TGV) Wafer status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Through Glass Via (TGV) Wafer development in United States, Europe and Japan.

The key players covered in this study

Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

Market segment by Type, the product can be split into

300 mm
200 mm
Below150 mm
300 mm Occupy the largest market share segmentation reached 64% and the fastest growth

Market segment by Application, split into

Biotechnology/Medical
Consumer Electronics
Automotive
Others
The largest segment is 56%; Biotechnology/Medical is the fastest growing

Market segment by Regions/Countries, this report covers

United States
Europe
Japan

The study objectives of this report are:

To analyze global Through Glass Via (TGV) Wafer status, future forecast, growth opportunity, key market and key players.
To present the Through Glass Via (TGV) Wafer development in United States, Europe and Japan.
To strategically profile the key players and comprehensively analyze their development plan and strategies.
To define, describe and forecast the market by type, market and key regions.

In this study, the years considered to estimate the market size of Through Glass Via (TGV) Wafer are as follows:
History Year: 2015-2019

Base Year:

2019

Estimated Year:

2020
Forecast Year 2020 to 2026
For the data information by region, company, type and application, 2019 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.