Global Quad-Flat-No-Lead Packaging(QFN) Market Research Report with Opportunities and Strategies to Boost Growth- COVID-19 Impact and Recovery

Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
Based on the Quad-Flat-No-Lead Packaging(QFN) market development status, competitive landscape and development model in different regions of the world, this report is dedicated to providing niche markets, potential risks and comprehensive competitive strategy analysis in different fields. From the competitive advantages of different types of products and services, the development opportunities and consumption characteristics and structure analysis of the downstream application fields are all analyzed in detail. To Boost Growth during the epidemic era, this report analyzes in detail for the potential risks and opportunities which can be focused on.

In Chapter 2.4 of the report, we share our perspectives for the impact of COVID-19 from the long and short term.
In chapter 3.4, we provide the influence of the crisis on the industry chain, especially for marketing channels.
In chapters 8-13, we update the timely industry economic revitalization plan of the country-wise government.

Key players in the global Quad-Flat-No-Lead Packaging(QFN) market covered in Chapter 5:
Texas Instruments
Microchip Technology Inc
Fujitsu Ltd
Amkor Technology
NXP Semiconductor
STATS ChipPAC Pte. Ltd
ASE Industrial Holding, Co., Ltd.
UTAC Group
Linear Technology Corporation

In Chapter 6, on the basis of types, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 is primarily split into:
Air-Cavity QFNs
Plastic Molded QFNs

In Chapter 7, on the basis of applications, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 covers:
Portable Devices
Radio Frequency (RF)
Wearable Devices
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2015-2025) of the following regions are covered in Chapter 8-13:
North America (Covered in Chapter 9)
United States
Canada
Mexico
Europe (Covered in Chapter 10)
Germany
UK
France
Italy
Spain
Russia
Others
Asia-Pacific (Covered in Chapter 11)
China
Japan
South Korea
Australia
India
South America (Covered in Chapter 12)
Brazil
Argentina
Columbia
Middle East and Africa (Covered in Chapter 13)
UAE
Egypt
South Africa

Years considered for this report:

Historical Years:

2015-2019

Base Year:

2019

Estimated Year:

2020

Forecast Period:

2020-2025