Global and United States Through Glass Via (TGV) Technology Market Report & Forecast 2022-2028

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
Market Analysis and Insights: Global and United States Through Glass Via (TGV) Technology Market
This report focuses on global and United States Through Glass Via (TGV) Technology market, also covers the segmentation data of other regions in regional level and county level.
Due to the COVID-19 pandemic, the global Through Glass Via (TGV) Technology market size is estimated to be worth US$ 63 million in 2022 and is forecast to a readjusted size of US$ 238.4 million by 2028 with a CAGR of 24.7% during the review period. Fully considering the economic change by this health crisis, by Type, 300 mm accounting for % of the Through Glass Via (TGV) Technology global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Application, Biotechnology/Medical was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
Global Through Glass Via (TGV) Technology key players include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, etc. Global top five manufacturers hold a share over 70%.
Asia-Pacific is the largest market, with a share over 15%, followed by Europe, and North America, both have a share over 15 percent.
In terms of product, 300 mm is the largest segment, with a share over 65%. And in terms of application, the largest application is Biotechnology/Medical, followed by Consumer Electronics, etc.
Global Through Glass Via (TGV) Technology Scope and Market Size
Through Glass Via (TGV) Technology market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Through Glass Via (TGV) Technology market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the Through Glass Via (TGV) Technology market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type
300 mm
200 mm
Less Than 150 mm
Segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
By Company
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia