Global Power Module Packaging Market Study 2015-2025, by Segment (GaN Module, FET Module, IGBT Module, … …), by Market (Wind Turbines, Rail TractionsMotors, Motors, … …), by Company (IXYS Corporation, Star Automations, DyDac Controls, … …

SKU ID : 99ST-13277603

Publishing Date : 24-Oct-2018

No. of pages : 67

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  • Snapshot
    The global Power Module Packaging market will reach xxx Million USD in 2018 and with a CAGR if xx% between 2019-2025.
    Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
    GaN Module
    FET Module
    IGBT Module
    SiC Module
    Demand Coverage (Market Size & Forecast, Consumer Distribution):
    Wind Turbines
    Rail Tractions
    Motors
    Electric Vehicles
    Photovoltaic Equipments
    Others
    Company Coverage (Sales data, Main Products & Services etc.):
    IXYS Corporation
    Star Automations
    DyDac Controls
    SEMIKRON
    Mitsubishi Electric Corporation
    Texas Instruments Incorporated
    Sanken Electric Co., Ltd.
    Fuji Electric Co. Ltd.
    Infineon Technologies AG
    SanRex Corporation
    Major Region Market
    North America
    Europe
    Asia-Pacific
    South America
    Middle East & Africa