Global Radiation Hardened Electronics and Semiconductors Market Report and 2020 Outlook

Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. Radiation hardened devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Radiation tolerant components are employed in satellite system power supply, switching regulators, and microprocessors in military and space applications. The prevention of gamma radiation and neutron radiation caused by nuclear reactors is possible due to radiation hardened components.

The global Radiation Hardened Electronics and Semiconductors market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Radiation Hardened Electronics and Semiconductors volume and value at global level, regional level and company level. From a global perspective, this report represents overall Radiation Hardened Electronics and Semiconductors market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
Honeywell Aerospace
BAE Systems
Microchip Technology
Xilinx Incorporation
Texas Instruments
Maxwell Technologies
Intersil Corporation
Atmel Corporation
Analog Devices Corporation
ST Microelectronics

Segment by Regions
North America
Europe
China
Japan

Segment by Type
Processors & Controllers
Logic
Memory
Power Management
ASICs
FPGAs

Segment by Application
Aerospace & Defense
Space