Global Hot-Melt Based Packaging Adhesives Market Insights, Forecast to 2025

The hot melt adhesives are defined as adhesives that melt and flow on application of heat and solidify on cooling to give a strong adhesion. They are applied in a molten state at temperatures that range from 120°C to 180°C depending on applications and materials to be bonded.
Hot-melt adhesives are composed of three main components: a high-molecular-weight polymer that provides the adhesives’ main structure and mechanical properties, a resin/tackifier that provides wetting and adhesion properties, and a plasticizer (or wax) that controls viscosity.
In general, the hot-melt based packaging adhesive is highly competitive. However, the major market share is occupied by a few players like Henkel, Bostik and H.B. Fuller. Depending on the different adhesive, different market segment, gross margins for hot-melt based packaging adhesives products commonly range from 15% to 20%. Hot-melt based packaging adhesives are selected and priced based on their performance characteristics.
Regionally, Indonesia, Thailand, Malaysia are the main consumption market of Hot-Melt Based Packaging Adhesives. For application, Case & Carton have kept to be the dominant segment of Hot-Melt Based Packaging Adhesives downstream industry. The downstream market would remain stable in the following years.
Hot-Melt Based Packaging Adhesives manufacturers have sales support and R & D staff that work closely with customers to modify existing products or develop new products. In many cases, the responsiveness of the R & D and technical customer service of the supplier are decisive factors in choosing adhesives. However, some major Adhesives producers, such as 3M, have reduced product differentiation and customization and are instead concentrating more on unique, but higher-margin, products with greater market potential.
Global Hot-Melt Based Packaging Adhesives market size will increase to xx Million US$ by 2025, from xx Million US$ in 2018, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Hot-Melt Based Packaging Adhesives.

This report researches the worldwide Hot-Melt Based Packaging Adhesives market size (value, capacity, production and consumption) in key regions like United States, Europe, Asia Pacific (China, Japan) and other regions.
This study categorizes the global Hot-Melt Based Packaging Adhesives breakdown data by manufacturers, region, type and application, also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:
Henkel
H. B. Fuller
Bostik (Arkema)
3M
Sika
Beardow Adams
Jowat
Avery Dennison
Adtek Malaysia
Cherng Tay Technology
Star Bond (Thailand)
Makro Rekat Sekawa
Yenom
PT.MORESCO MACRO ADHESIVE
Tex Year Industries
Nan Pao
Paramelt

Hot-Melt Based Packaging Adhesives Breakdown Data by Type
EVA HMA
SBC HMA
PA HMA
APAO HMA
POE HMA
Hot-Melt Based Packaging Adhesives Breakdown Data by Application
Case & Carton
Plastic Packaging
Labeling
Line Packaging
Others

Hot-Melt Based Packaging Adhesives Production Breakdown Data by Region
United States
Europe
China
Japan
Other Regions

Hot-Melt Based Packaging Adhesives Consumption Breakdown Data by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

The study objectives are:
To analyze and research the global Hot-Melt Based Packaging Adhesives capacity, production, value, consumption, status and forecast;
To focus on the key Hot-Melt Based Packaging Adhesives manufacturers and study the capacity, production, value, market share and development plans in next few years.
To focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Hot-Melt Based Packaging Adhesives :
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.